Shallow trench isolation structures having uniform step heights

ABSTRACT

The present disclosure describes a method that includes forming a fin protruding from a substrate, the fin including a first sidewall and a second sidewall formed opposite to the first sidewall. The method also includes depositing a shallow-trench isolation (STI) material on the substrate. Depositing the STI material includes depositing a first portion of the STI material in contact with the first sidewall and depositing a second portion of the STI material in contact with the second sidewall. The method also includes performing a first etching process on the STI material to etch the first portion of the STI material at a first etching rate and the second portion of the STI material at a second etching rate greater than the first etching rate. The method also includes performing a second etching process on the STI material to etch the first portion of the STI material at a third etching rate and the second portion of the STI material at a fourth etching rate less than the third etching rate.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. Provisional Patent Appl. No. 63/031,245, titled “Shallow Trench Isolation (STI) Structures Having Uniform Step Heights” and filed on May 28, 2020, which is incorporated herein by reference in its entirety.

BACKGROUND

With advances in semiconductor technology, there has been increasing demand for higher storage capacity, faster processing systems, higher performance, and lower costs. To meet these demands, the semiconductor industry continues to scale down the dimensions of semiconductor devices. Fin-type field effect transistors (finFETs) have been developed to reduce device footprint and improve device performance. FinFETs are FETs formed over a fin that is vertically oriented with respect to a planar surface of a wafer.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of this disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the common practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a flow diagram of a method for forming a semiconductor structure, in accordance with some embodiments.

FIGS. 2-6 illustrate various views of semiconductor fins and STI material at various stages of their fabrication process, in accordance with some embodiments.

FIGS. 7-11 are flow diagrams of methods for forming semiconductor structures, in accordance with some embodiments.

FIG. 12 is a cross-sectional view of a semiconductor device, in accordance with some embodiments.

FIG. 13 is an isometric view of a semiconductor device, in accordance with some embodiments.

Illustrative embodiments will now be described with reference to the accompanying drawings. In the drawings, like reference numerals generally indicate identical, functionally similar, and/or structurally similar elements.

DETAILED DESCRIPTION

The following disclosure provides different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are disposed between the first and second features, such that the first and second features are not in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

The term “nominal” as used herein refers to a desired, or target, value of a characteristic or parameter for a component or a process operation, set during the design phase of a product or a process, together with a range of values above and/or below the desired value. The range of values is typically due to slight variations in manufacturing processes or tolerances.

In some embodiments, the terms “about” and “substantially” can indicate a value of a given quantity that varies within 5% of the value (e.g., ±1%, ±2%, ±3%, ±4%, ±5% of the value). These values are merely examples and are not intended to be limiting. The terms “about” and “substantially” can refer to a percentage of the values as interpreted by those skilled in relevant art(s) in light of the teachings herein.

The present disclosure provides methods for forming finFET devices. The term “finFET” refers to a FET formed over a fin that is vertically oriented with respect to a planar surface of a wafer. The term “vertical,” as used herein, refers to nominally perpendicular to the surface of a substrate. The methods can also be applied towards forming any suitable semiconductor structures, such as horizontal or vertical gate-all-around FETs (GAAFETs).

The performance and scalability of silicon-based transistors is reaching fundamental limits despite the implementation of various enhancement techniques, such as novel device architectures for enhanced electrostatic control, transport enhancement by strained channels, improved dopant activation, and parasitic resistance reduction. As device dimensions are scaled down to achieve higher packing density, it has been a challenge to shrink silicon-based transistors. FinFETs have been developed to reduce device footprint and improve device performance. The fins of finFETs may be formed on a semiconductor substrate by one or more photolithography processes, including double-patterning or multi-patterning processes. After fins are formed, a layer of shallow trench isolation (STI) material can be deposited on the substrate and surrounding the fins, providing electrical isolation between adjacent fins. Source/drain regions and channel regions of FETs can be formed on portions of the fins that protrude from a top surface of the STI material. However, as device dimensions are scaled down, heights of STI material can vary across the wafer and cause fin height non-uniformity. For example, due to loading effects, the step height of STI material between fins can be greater than the step height of STI material formed surrounding an outermost fin of a group of fins.

Various embodiments in the present disclosure describe methods for forming semiconductor devices with substantially uniform STI step heights. An STI material can be deposited on a substrate and surround multiple fins, followed by an etch back process to expose portions of the fins. Semiconductor devices formed using the methods disclosed herein can have substantially uniform STI step height across multiple fins. For example, an inner STI step height (e.g., STI step height between adjacent fins) can be substantially equal to an outer STI step height (e.g., STI step height for the outermost fin). Multiple etching processes can be used to achieve substantially uniform STI step heights. For example, the etching back process can include etching processes that removes STI material at different rates depending on the location of the targeted STI material. For example, a thermal etching process can etch STI material formed adjacent to the outermost fin at a greater etching rate than STI material formed between a pair of adjacent fins. A plasma-activated etching process can remove STI material at a greater rate from between adjacent fins than removing STI material that is adjacent to the outermost fin. The etched STI material can be exposed to a radical treatment process, during which surfaces of the etched STI material can be exposed to hydrogen radicals. The radical treatment process can adjust the surface profile of the STI material as well as further etching the STI material. A combination of multiple etching and treatment process can provide the benefits of, among other things, substantially uniform STI step height throughout multiple fins. For example, inner STI step height can be substantially similar to the outer STI step heights. In some embodiments, STI step heights can be tuned using the etching and treatment process to achieve different step heights based on device needs. For example, inner STI step heights can be greater than outer step heights.

FIG. 1 is a flow diagram of a method 100 for forming STI material having substantially uniform step height, according to some embodiments. For illustrative purposes, the operations illustrated in FIG. 1 will be described with reference to the example fabrication process illustrated in FIGS. 2-6 . Operations can be performed in a different order or not performed depending on specific applications. It should be noted that method 100 may not produce a complete semiconductor device. Accordingly, it is understood that additional processes can be provided before, during, and after method 100, and that some other processes may only be briefly described herein.

Referring to FIG. 1 , in operation 110, fin structures are formed on a substrate, according to some embodiments. As shown in FIG. 2 , multiple fins 204 can be formed on a substrate 202 and protrude from a top surface of substrate 202. In some embodiments, substrate 202 can be a wafer and formed using suitable materials, such as an elementary semiconductor, a compound semiconductor, an alloy semiconductor, and any suitable materials. In some embodiments, substrate 202 includes a crystalline silicon substrate (e.g., wafer). In some embodiments, substrate 202 includes (i) an elementary semiconductor, such as germanium; (ii) a compound semiconductor including silicon carbide, gallium arsenide, gallium phosphide, indium phosphide, indium arsenide, and/or indium antimonide; (iii) an alloy semiconductor including silicon germanium carbide, silicon germanium, gallium arsenic phosphide, gallium indium phosphide, gallium indium arsenide, gallium indium arsenic phosphide, aluminum indium arsenide, and/or aluminum gallium arsenide; or (iv) a combination thereof. Further, substrate 202 can be doped depending on design requirements (e.g., p-type substrate or n-type substrate). In some embodiments, substrate 202 can be doped with p-type dopants (e.g., boron, indium, aluminum, or gallium) or n-type dopants (e.g., phosphorus or arsenic).

Fins 204 traverse along a Y-axis. Although a pair of fins 204 are illustrated in FIG. 3 , additional fins are formed between the pair of fins 204 to form multiple fins and the pair of fins 204 represent the outermost fins of the multiple fins. The additional fins are referred to herein as inner fins and are not illustrated for simplicity. Outermost fins 204 can have inner sidewalls 204A facing toward the inner fins and outer sidewalls 204B on the opposing side, as shown in FIG. 3 . Inner fins can have inner sidewalls that opposes inner sidewalls from adjacent inner fins and inner sidewalls 204A of outermost fins 204. Top surfaces of fins 204 can be substantially coplanar (e.g., aligned on the same horizontal plane).

In some embodiments, fins 204 can include material similar to substrate 202. In some embodiments, fins 204 can be formed from a photolithographic patterning and an etching of substrate 202. Based on the disclosure herein, it will be recognized that other materials for fins 204 are within the scope and spirit of this disclosure. Fins 204 are current-carrying structures for finFETs. Channel regions (not shown) of finFETs can be formed in portions of fin structures 204. In some embodiments, each fin of fins 204 can include multiple nanowire structures (not shown) for forming GAAFET devices. Fins 204 can be formed by etching substrate 202 through patterned first and second hard mask layers 206 and 208 formed on un-etched substrate 202. In some embodiments, first hard mask layer 206 is a thin film including silicon oxide formed using a thermal oxidation process. In some embodiments, second hard mask layer 208 can be formed of silicon nitride using low pressure chemical vapor deposition (LPCVD) or plasma enhanced CVD (PECVD). In some embodiments, fins 204 can include a top portion 204A having substantially uniform width along the X-axis and a bottom portion 204B having a width that gradually changes along the Z-axis.

Referring to FIG. 1 , in operation 120, a shallow trench isolation (STI) material is deposited on the substrate and surrounds the fin structures, according to some embodiments. As shown in FIG. 3 , STI material 310 is deposited on substrate 202 and surrounds fins 204. STI material 310 can include inner portion 310A deposited on substrate 202 and between adjacent fins 204. STI material 310 can also include outer portions 310B deposited on substrate 202 and on outer sidewalls of outermost fins 204. Inner portions 310A can be formed between outermost fins and between adjacent inner fins formed between the outermost fins. STI material 310 can electrically isolate adjacent fins from neighboring active and passive elements (not illustrated herein) integrated with or deposited onto substrate 202. STI material 310 can be made of a dielectric material. In some embodiments, STI material 310 can include silicon oxide, silicon nitride, silicon oxynitride, fluorine-doped silicate glass (FSG), a low-k dielectric material, and/or other suitable insulating material. In some embodiments, STI material 310 can be formed by depositing a flowable dielectric material, such as flowable silicon oxide, flowable silicon nitride, flowable silicon oxynitride, flowable silicon carbide, or flowable silicon oxycarbide. For example, flowable silicon oxide can be deposited using flowable CVD (FCVD). In some embodiments, STI material 310 can be deposited using other suitable CVD processes, physical vapor deposition (PVD), atomic layer deposition (ALD), or any suitable deposition processes. A planarization process can be used after the deposition of STI material 310 to remove hard mask layers 206 and 208 such that top surfaces of fins 204 and STI material 310 are substantially coplanar (e.g., level with each other).

Referring to FIG. 1 , in operation 130, the shallow trench isolation (STI) material is etched back using one or more etching processes and treatment processes, according to some embodiments. An exemplary operation 130 can include operation 132 which includes performing a first etching process, operation 134 which includes performing a second etching process, and operation 136 which includes an optional radical treatment process 136. Operations 132 and 134 can remove STI material 310 at different etching rates depending on the location of the targeted STI material. For example, operation 132 can be a thermal etching process that etches outer portions 310B of STI material 310 at a greater etching rate than inner portions 310A of STI material 310. In contrast, operation 134 can be a plasma-activated etching process that removes inner portions 310A at a greater rate than removing outer portions 310B. The etching and treatment processes described in operation 130 can be performed in a different order or not performed depending on specific applications.

Referring to FIG. 1 , in operation 132, a first etching process is performed, according to some embodiments. As shown in FIG. 4 , a first etching process 402 can be performed to etch back a portion of STI material 310. In some embodiments, first etching process 402 can be a thermal etching process using ammonia (NH₃) and hydrogen fluoride (HF) as precursors. First etching process 402 can be a non-plasma etching process and performed at an elevated temperature. First etching process 402 can etch STI material 310 at different rates depending on the location of the targeted STI material. For example, the etching rate E₁ of first etching process 402 in outer portions 310B of STI material 310 is greater than the etching rate E₂ for inner portions 310A of STI material 310. The etching rate difference can be attributed to the pattern loading effect, a phenomenon that is derived from differences in radiant energy absorption in different areas of a semiconductor device or die on account of the different patterning (e.g., pattern density, aspect ratio of features, composition/reflectivity of features, etc.). In some embodiments, a ratio N₁ of etching rate E₁ over etching rate E₂ can be about 1 and about 2, or any suitable ratios. For example, ratio N₁ can be greater than or equal to about 1 and less than about 2. Etching rate differences greater than the aforementioned ranges of N₁ can lead to etching non-uniformity that can be challenging to address. The value of ratio N₁ can depend on the separation between adjacent fins of multiple fins. Decreasing the separation between fins can result in a greater etch rate difference between etching rates E₁ and E₂. The precursor flow rates and etching temperature can be adjusted such that the ratio N₁ is within the aforementioned ranges.

First etching process 402 can proceed until a nominal etching height of STI material is removed. In some embodiments, the height of STI material removed from outer portions 310B of STI material can be denoted as H₁, measured from top surfaces of fins 204 and a top planar surface of etched outer portions 310B. Similarly, the height of STI material removed from inner portions 310A of STI material can be denoted as H₂, measured from top surfaces of fins 204 and a top planar surface of etched inner portions 310A. In some embodiments, a total height of STI material to be removed can be denoted as H, measured from a top surface of fins 204 and a targeted top surface of remaining STI material. In some embodiments, a ratio N₂ of heights H₁ over H₂ can be equal to ratio N₁. In some embodiments, first etching process 402 can remove the majority of the total STI to be removed. In some embodiments, a ratio N₃ of height H₁ over total height H can be between about 0.65 and about 0.90. A value of ratio N₃ outside of the aforementioned ranges can result in limited device performance gain or lower yield.

In some embodiments, gas sources can dispense precursors at predetermined flow rates for first etching process 402. For example, a gas source can dispense ammonia precursors into an etching chamber at a flow rate of from about 5 standard cubic centimeters per minute (sccm) to about 110 sccm, from about 10 sccm to about 100 sccm, or any suitable flow rates. The gas source can also dispense hydrogen fluoride precursors at a flow rate of from about 80 sccm to about 1200 sccm, from about 90 sccm to about 1100 sccm, from about 100 sccm to about 1000 sccm, or any suitable flow rates. Values of flow rates that are outside the aforementioned ranges can result in limited device performance gain or lower yield. In some embodiments, the etching chamber can be a chamber configured to conduct a Siconi etching process (e.g., a plasma-assisted dry etching process). In some embodiments, STI material 310 can be formed using silicon oxide. Chemical reactions during first etching process 402 can include generating ammonium fluoride (NH₄F) molecules using the dispensed precursors. When exposed to ammonium fluoride molecules, the silicon oxide material of STI material 310 can react to generate ammonium hexafluorosilicate ((NH₄)₂SiF₆) which in turn reacts with water and generates byproducts of silicon tetrafluoride (SiF₄). Some of the chain chemical reactions of first etching process 402 can be represented using the following chemical representations: NH₃+HF→NH₄F and SiO₂+NH₄F→(NH₄)₂SiF₆+H₂O→SiF₄(g)+NH₃(g)+HF(g).

In some embodiments, first etching process 402 can be performed at a temperature between about 25° C. and about 50° C. For example, the etching chamber used to perform first etching process 402 can be maintained at a temperature between about 25° C. and about 30° C., between about 30° C. and about 35° C., between about 35° C. and about 40° C., between about 40° C. and about 45° C., between about 45° C. and about 50° C., or any suitable temperatures. Temperatures below or above the aforementioned ranges can cause low chemical reactivity of the precursors which can in turn lead to low etching rates or ineffective etching.

Referring to FIG. 1 , in operation 134, a second etching process is applied to further remove STI material, according to some embodiments. As shown in FIG. 5 , a second etching process 502 can be performed to further etch back STI material 310. In some embodiments, second etching process 502 can be a plasma-activated etching process using ammonia (NH₃) and nitrogen trifluoride (NF₃) as precursors. Second etching process 502 can be a plasma-activated etching process using a plasma etching apparatus. The plasma can be generated in a plasma generation process by a plasma generator such as a transformer-coupled plasma generator, inductively coupled plasma system, magnetically enhanced reactive ion etching system, electron cyclotron resonance system, remote plasma generator, or the like. The plasma generator generates radio frequency power that produces a plasma from ammonia and nitrogen trifluoride fluoride, such as by applying a voltage above the striking voltage to electrodes in a chamber containing the precursors. Compared to first etching process 402, second etching process 502 can remove STI material 310 at lower rates on outer portions than inner portions of STI material, according to some embodiments. For example, the etching rate E₃ of second etching process 502 in outer portions 310B of STI material 310 can be lower than the etching rate E₄ for inner portions 310A. The etching rate difference can be attributed to the generation of ammonia fluoride radicals that can assist in etching in tight spaces, such as the STI material located between adjacent fins. In some embodiments, remnant traces of oxygen in the process chamber can form a layer of native oxide on fins 204 during first and second etching processes 402 and 502. Plasma species used in second etching process 502 (e.g., NH₃ and NF₃) can etch native oxide at an etching rate that is slower than plasma species used in first etching process 402 (e.g., NH₃ and HF), therefore providing more radicals in the tight spaces between fins for increasing the etching rate of STI material 310. In some embodiments, a ratio N₄ of etching rate E₃ over etching rate E₄ can be less than or equal to 1 and greater than about 0.5. Etching rate differences greater than the aforementioned ranges of N₄ can lead to challenges in providing a substantially uniform etch across multiple fins. The precursor flow rates and plasma intensity can be adjusted such that the ratio N₄ is within the aforementioned ranges. Second etching process 502 can proceed until a nominal etching height of STI material is removed. In some embodiments, the height of STI material removed from outer portions 310B of STI material during second etching process 502 can be denoted as H₃. Similarly, the height of STI material removed from inner portions 310A of STI material during second etching process 502 can be denoted as H₄. In some embodiments, a ratio N₅ of heights H₃ over H₄ can be equal to ratio N₄. In some embodiments, second etching process 502 can remove a smaller amount of STI material than first etching process 402. In some embodiments, a ratio N₆ of height H₃ over total height H can be between about 0.10 and about 0.35. In some embodiments, second etching process 502 can be used to counter the surface unevenness (e.g., differences in heights H₁ and H₂) caused by first etching process 402 such that after first and second etching process 402 and 502, the top surfaces of inner portions 310A and outer portions 310B are substantially coplanar (e.g., level). Second etching process can continue until a nominal fin height (e.g., height of fin 204 protruding from STI material 310) or until the top surfaces of inner and outer portions 310A and 310B are substantially coplanar. In some embodiments, second etching process can proceed until top surfaces of inner portions 310A are lower than top surfaces of outer portions 310B.

In some embodiments, gas sources can dispense precursors at predetermined flow rates for second etching process 502. For example, a gas source can dispense ammonia precursors into an etching chamber at a flow rate of from about 5 sccm to about 320 sccm, from about 7 sccm to about 310 sccm, from about 10 sccm to about 300 sccm, or any suitable flow rates. The gas source can also dispense nitrogen trifluoride precursors at a flow rate of from about 35 sccm to about 600 sccm, from about 40 sccm to about 550 sccm, from about 50 sccm to about 500 sccm, or any suitable flow rates. In some embodiments, STI material 310 can be formed using silicon oxide. Chemical reactions during second etching process 502 can include generating ammonium fluoride (NH₄F) radicals as well as ammonium fluoride molecules using the dispensed precursors and under plasma. When exposed to ammonium fluoride molecules and radicals, the silicon oxide material of STI material 310 can react to generate ammonium hexafluorosilicate which in turn reacts with water and generate byproducts of silicon tetrafluoride. Some of the chain chemical reactions of second etching process 502 can be represented using the following chemical representations: NH₃+NF₄→plasma (RF)→NH₄F+NH₄F.HF and SiO₂+NH₄F→(NH₄)₂SiF₆+H₂O→SiF₄ (g)+NH₃ (g)+HF (g). In some embodiments, an anneal process can be used during or after the etching process. For example, an annealing process can be performed to enhance the generation of silicon tetrafluoride gas. In some embodiments, the anneal process can be performed at a temperature between about 30° C. and about 80° C. Annealing processes performed at a temperature below about 30° C. can lead to insufficient sublimation of (NH₄)₂SiF₆, which in turn can result in poor etching performance (e.g., residue or defect generation). Annealing processes performed at temperatures greater than about 80° C. can result in unstable plasma species which in turn can lead to plasma degradation.

In some embodiments, second etching process 502 can be performed in a plasma chamber. A radio frequency (RF) source can be applied to the plasma chamber to excite the ions from precursors and create plasma. The power of the RF source can be between about 25 W and about 75 W. For example, the power can be between about 25 W and about 40 W, between about 40 W and about 50 W, between about 50 W and about 75 W, or any suitable RF power. RF power below the aforementioned ranges can cause low chemical reactivity of the precursors which can in turn lead to low etching rates or ineffective etching. RF power greater than the aforementioned ranges can lead to challenges in providing a consistent etching rate.

Referring to FIG. 1 , in operation 136, a radical treatment process is applied to on the STI material, according to some embodiments. As shown in FIG. 6 , a radical treatment process 602 is applied to the top surfaces of STI material 310. In some embodiments, radical treatment process can be optional. The radical treatment process can be a hydrogen radical treatment process, in which surfaces of STI material 310 are exposed to hydrogen radicals. Hydrogen radicals readily react with Group IV materials to form tetrahydride compounds. The hydrogen radical treatment process can be performed in a chamber, such as an etching chamber. In some embodiments, radical treatment process 602 can be performed in the processing chambers used to perform first and second etching processes 402 and 502. In some embodiments, radical treatment process 602 can be a plasma-assisted radical treatment process. For example, the plasma-assisted radical treatment process can use hydrogen or helium as precursors. For example, one or more gas sources are dispensed in the etching chamber. The gas source includes a precursor gas and an inert gas. The precursor gas can include hydrogen (H₂), and the inert gas can include argon (Ar), helium (He), or a combination thereof. A plasma is generated after the precursor gases are dispensed into the processing chamber. The plasma can be generated in a plasma generation process by a plasma generator. When exposed to the hydrogen plasma, the material (e.g., silicon oxide) at the surface of the STI material 310 breaks apart and recombines with the free hydrogen ions to form silane (SiH₄) and water (H₂O), thus removing the dielectric material at top surfaces of STI material 310. The byproducts can be removed from the processing chamber during their formation by vacuuming. As shown in FIG. 6 , dielectric material can be uniformly removed from inner portions 310A and outer portions 310B of STI material 310. In some embodiments, the height of STI material removed from inner portions 310A and outer portions 310B of STI material during radical treatment process 602 can be denoted as H₅. In some embodiments, a ratio N₇ of height H₅ over total height H can be less than about 0.05.

FIGS. 7-11 are flow diagrams of methods for etching back STI material to expose multiple fins, according to some embodiments. For illustrative purposes, the operations illustrated in FIGS. 7-11 can be similar to those illustrated in FIGS. 2-6 . For example, each of the methods described in FIGS. 7-11 can be used for performing operation 130 described in FIG. 1 . Operations can be performed in a different order or not performed depending on specific applications. It should be noted that the methods described in FIGS. 7-11 are for etching back STI material and may not produce a complete semiconductor device. Accordingly, it is understood that additional processes can be provided before, during, and after the methods disclosed herein, and that some other processes may only be briefly described.

Referring to FIG. 7 , method 700 can include operation 702 that includes a plasma-activated etching process, operation 704 that includes a thermal etching process, and operation 706 that includes a radical treatment process. In some embodiments, the plasma-activated etching process in operation 702 can be similar to second etching process described with reference to FIG. 5 . For example, the plasma-activated etching process in operation 702 can have different etching rates on inner portions and outer portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material can have a height between about 10% and 35% of the total height of the STI material to be removed. In some embodiments, the thermal etching process of operation 704 can be similar to first etching process 402 described in FIG. 4 . For example, the thermal etching process of operation 704 can remove STI material at a greater rate in the outer portions of the STI material than the inner portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material during operation 704 can be between about 65% and about 90% of the total height of the STI material to be removed. Second operations 702 and 704 can be followed by operation 706 which includes performing a radical treatment process that is similar to radical treatment process 602 described in FIG. 6 . For example, a hydrogen radical treatment process can be performed to further remove STI material. After the operations described in method 700, the top surfaces of inner portions and outer portions of etched-back STI material can be substantially coplanar. In some embodiments, top surfaces of the inner portions can be lower than the top surfaces of the outer portions.

Referring to FIG. 8 , method 800 can include operation 802 that includes a thermal etching process, operation 804 that includes a radical treatment process, and operation 806 that includes a plasma-activated etching process. In some embodiments, the thermal etching process of operation 802 can be similar to first etching process 402 described in FIG. 4 . For example, the thermal etching process of operation 802 can remove STI material at a greater rate in the outer portions of the STI material than the inner portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material during operation 802 can be between about 65% and about 90% of the total height of the STI material to be removed. Operation 804 can include a radical treatment process that is similar to radical treatment process 602 described in FIG. 6 . For example, a hydrogen radical treatment process can be performed to further remove STI material. In some embodiments, the plasma-activated etching process in operation 804 can be similar to second etching process 502 described with reference to FIG. 5 . For example, the plasma-activated etching process in operation 804 can have different etching rates on inner portions and outer portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material can have a height between about 10% and 35% of the total height of the STI material to be removed.

Referring to FIG. 9 , method 900 can include operation 902 that includes a plasma-activated etching process, operation 904 that includes a radical treatment process, and operation 906 that includes a thermal etching process. In some embodiments, the plasma-activated etching process in operation 902 can be similar to second etching process 502 described with reference to FIG. 5 . For example, the plasma-activated etching process in operation 902 can have different etching rates on inner portions and outer portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material can have a height between about 10% and 35% of the total height of the STI material to be removed. Operation 904 can include a radical treatment process that is similar to radical treatment process 602 described in FIG. 6 . For example, a hydrogen radical treatment process can be performed to further remove STI material. In some embodiments, the thermal etching process of operation 906 can be similar to first etching process 402 described in FIG. 4 . For example, the thermal etching process of operation 906 can remove STI material at a greater rate in the outer portions of the STI material than the inner portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material during operation 906 can be between about 65% and about 90% of the total height of the STI material to be removed.

Referring to FIG. 10 , method 1000 can include operation 1002 that includes a thermal etching process, operation 1004 that includes a first radical treatment process, operation 1006 that includes a plasma-activated etching process, and operation 1008 that includes a second thermal etching process. In some embodiments, the thermal etching process of operation 1002 can be similar to first etching process 402 described in FIG. 4 . For example, the thermal etching process of operation 1002 can remove STI material at a greater rate in the outer portions of the STI material than the inner portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material during operation 1002 can be between about 65% and about 90% of the total height of the STI material to be removed. Operation 1004 can include a first radical treatment process that is similar to radical treatment process 602 described in FIG. 6 . For example, a hydrogen radical treatment process can be performed to further remove STI material. In some embodiments, the plasma-activated etching process in operation 1006 can be similar to second etching process 502 described with reference to FIG. 5 . For example, the plasma-activated etching process in operation 1006 can have different etching rates on inner portions and outer portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material can have a height between about 10% and 35% of the total height of the STI material to be removed. In some embodiments, the second radical treatment process in operation 1008 can be similar to first radical treatment in operation 1004. In some embodiments, each of the first and second radical treatment processes in operations 1004 and 1008 can etch back about 1% to about 5% of the total STI material to be removed.

Referring to FIG. 11 , method 1100 can include operation 1102 that includes a plasma-activated etching process, operation 1104 that includes a first radical treatment process, operation 1106 that includes a thermal etching process, and operation 1108 that includes a second radical treatment process. In some embodiments, the plasma-activated etching process in operation 1102 can be similar to second etching process 502 described with reference to FIG. 5 . For example, the plasma-activated etching process in operation 1102 can have different etching rates on inner portions and outer portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material can have a height between about 10% and 35% of the total height of the STI material to be removed. Operation 1104 can include a first radical treatment process that is similar to radical treatment process 602 described in FIG. 6 . For example, a hydrogen radical treatment process can be performed to further remove STI material. In some embodiments, the thermal etching process of operation 1106 can be similar to first etching process 402 described in FIG. 4 . For example, the thermal etching process of operation 1106 can remove STI material at a greater rate in the outer portions of the STI material than the inner portions of the STI material. In some embodiments, the removed material from the outer portions of the STI material during operation 1002 can be between about 65% and about 90% of the total height of the STI material to be removed. In some embodiments, the second radical treatment process in operation 1108 can be similar to first radical treatment in operation 1104. In some embodiments, each of the first and second radical treatment processes in operations 1104 and 1108 can etch back about 1% to about 5% of the total STI material to be removed.

The thermal etching processes and plasma-activated etching process can provide etched-back STI material with substantially coplanar top surfaces. In some embodiments, the etching processes can also provide inner portions of etched-back STI material with top surfaces that are lower than the top surfaces of the outer portions of the etched-back STI material. As shown in FIG. 12 , a top surface of inner portions 310A can be lower than a top surface of outer portion 310B. For example, a height H₆ of STI material removed from between fins 204 can be greater than height H of the STI material removed from the outside of fins 204. In some embodiments, a ratio of H₆ over H can be greater than or equal to about 1 and less than about 1.2. In some embodiments, a difference between heights H₆ and H can be less than about 5 nm. For example, the difference can be between about 3 nm and about 5 nm. Increasing the difference between heights H₆ and H can provide benefits, among other things, more effective fin area and less gate-to-channel capacitance (CO between fin-fin spacing.

Referring to FIG. 1 , in operation 140, structures of semiconductor devices can be formed on the STI material and on the fin structures, according to some embodiments. As shown in FIG. 13 , additional structures can be formed on the protruding fins after STI material has been etched back.

FIG. 13 is an isometric view of a semiconductor structure 1300, in accordance with some embodiments of the present disclosure. Semiconductor structure 1300 includes finFETs that are formed using the fins and STI material formed using the methods and structures described with reference to FIGS. 1-12 . For example, semiconductor structure 1300 includes substrate 202, multiple fins 204, STI material 310, and a gate structure 1380. Gate structure 1380 is disposed over sidewalls and a top surface of each of fins 204. Gate structure 1380 includes a gate dielectric layer 1302 and a gate electrode 1307. In some embodiments, one or more additional layers or structures can be included in gate structure 1380.

FIG. 13 shows a hard mask 1320 disposed on a top surface of gate electrode 1307. Hard mask 1320 is used to pattern, such as by etching, gate structure 1380. In some embodiments, hard mask 1320 includes a dielectric material, such as silicon nitride. The isometric view of FIG. 13 is taken after the patterning process (e.g., etching) of a gate dielectric layer and a gate electrode layer to form gate structure 1380. Integrated circuits can include multiple of such, and similar, gate structures.

Each of the multiple fins 204 includes a pair of source/drain (S/D) terminals S/D 1308. S/D 1308 are formed in, on, and/or surrounding fins 204. A channel region of fins 204 underlies gate structure 1380. S/D 1308 can be formed using doped semiconductor material, such as doped crystalline silicon. In some embodiments, S/D 1308 can be formed using silicon germanium.

STI material 310 can partially fill the recesses and can include a dielectric material such as, for example, silicon oxide, spin-on-glass, silicon nitride, silicon oxynitride, fluorine-doped silicate glass (FSG), a low-k dielectric material, other suitable insulating material, and/or combinations thereof. STI material 310 can include a multi-layer structure such as, for example, a structure with one or more liner layers. STI material 310 can also be formed by depositing an enhanced gap fill layer using multi-step deposition and treatment process to eliminate voids and seams in the gap fill material. STI material 310 can be etched back using the methods described in FIGS. 1-12 .

Gate structure 1380 can include a gate dielectric layer 1302, a gate electrode 1307, and/or one or more additional layers, according to some embodiments. In some embodiments, gate structure 1380 uses polysilicon as gate electrode 1307. Although gate structure 1380 is described as using polysilicon or amorphous silicon for gate electrode 1307, gate structure 1380 can be a sacrificial gate structure, such as a gate structure formed in a replacement gate process for a metal gate structure. The metal gate structure can include barrier layer(s), gate dielectric layer(s), work function layer(s), fill metal layer(s), and/or other suitable materials for a metal gate structure. In some embodiments, the metal gate structure can include capping layers, etch stop layers, and/or other suitable materials.

P-type and n-type work function metals can be included in the metal gate structure. A work function is associated with the material composition of the work function layer. Thus, the material of a work function layer can be chosen to tune its work function so that a desired threshold voltage V_(th) is achieved by a device formed in the respective region.

A fill metal layer can be deposited over the work function metal layer(s). The fill metal layer fills in remaining portions of trenches or openings formed by removal of the sacrificial gate structure. The fill metal layer can include Al, W, copper (Cu), and/or other suitable materials. The fill metal can be formed by ALD, CVD, physical vapor deposition (PVD), plating, other suitable processes, and/or combinations thereof.

Semiconductor structure 1300 described above includes fins 204 and gate structure 1380. Semiconductor structure 1300 can include multiple gate structures 108 formed over fins 204. Semiconductor structure 1300 can include additional processing to form various features such as, for example, lightly-doped-drain (LDD) regions and doped S/D structures. The term “LDD region” is used to describe lightly-doped regions disposed between a channel region of a transistor and at least one of the transistor's S/D regions. LDD regions can be formed in fins 204 by doping. Ion implantation can be used, for example, for the doping process. Other processes can be used for doping the LDD regions.

Various embodiments in the present disclosure describe methods for forming semiconductor devices with substantially uniform STI step heights. An STI material can be deposited on a substrate and surround multiple fins, followed by an etch back process to expose portions of the fins. Semiconductor devices formed using the methods disclosed herein can have substantially uniform STI step heights across multiple fins. In some embodiments, an inner STI step height can be substantially equal to or less than an outer STI step height. Multiple etching processes can be used to achieve the substantially uniform STI step heights. For example, the etching back process can include etching processes that removes STI material at different rates depending on the location of the targeted STI material. The etched STI material can be exposed to a radical treatment process, which can adjust the surface profile of the STI material as well as further etching the STI material.

In some embodiments, a method includes forming a fin protruding from a substrate, the fin including a first sidewall and a second sidewall formed opposite to the first sidewall. The method also includes depositing a shallow-trench isolation (STI) material on the substrate. Depositing the STI material includes depositing a first portion of the STI material in contact with the first sidewall and depositing a second portion of the STI material in contact with the second sidewall. The method also includes performing a first etching process on the STI material to etch the first portion of the STI material at a first etching rate and the second portion of the STI material at a second etching rate greater than the first etching rate. The method also includes performing a second etching process on the STI material to etch the first portion of the STI material at a third etching rate and the second portion of the STI material at a fourth etching rate less than the third etching rate.

In some embodiments, a method, includes forming a plurality of fins protruding from a substrate, the plurality of fins including first and second outermost fins, wherein: the first outermost fin includes a first inner sidewall and a first outer sidewall formed opposite to the first inner sidewall; and the second outermost fin includes a second inner sidewall opposing the first inner sidewall and a second outer sidewall formed opposite to the second inner sidewall. The method also includes depositing a shallow-trench isolation (STI) material on the substrate, including depositing a first portion of the STI material between the first and second inner sidewalls and depositing a second portion of the STI material in contact with the first and second outer sidewalls. The method also includes performing a first etching process on the STI material to etch the first portion of the STI material at a first etching rate and the second portion of the STI material at a second etching rate greater than the first etching rate. The method further includes performing a second etching process on the STI material to etch the first portion of the STI material at a third etching rate and the second portion of the STI material at a fourth etching rate less than the third etching rate.

In some embodiments, a semiconductor structure includes a plurality of fins protruding from a substrate and including first and second outermost fins, wherein: the first outermost fin has first and second sidewalls opposite to each other; the second outermost fin has third and fourth sidewalls opposite to each other, wherein the second and third sidewalls face each other; and the top surfaces of the first and second outermost fins are aligned on a horizontal plane. The semiconductor structure also includes a shallow trench isolation (STI) material on the substrate, the STI material includes a first portion in contact with the first sidewall and having a first top surface, wherein a first height is measured from the first top surface to the horizontal plane. The STI material also includes a second portion between the first and second outermost fins and having a second top surface, wherein a second height is measured from the second top surface to the horizontal plane and the second height is greater than the first height.

The foregoing disclosure outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. 

What is claimed is:
 1. A method, comprising: forming a fin protruding from a substrate, the fin comprising a first sidewall and a second sidewall formed opposite to the first sidewall; depositing a shallow-trench isolation (STI) material on the substrate, comprising: depositing a first portion of the STI material in contact with the first sidewall; and depositing a second portion of the STI material in contact with the second sidewall; performing a first etching process on the STI material to remove a first height of the STI material in the first portion at a first etching rate and a second height of the STI material in the second portion at a second etching rate greater than the first etching rate; performing a second etching process on the STI material to remove a third height of the STI material in the first portion at a third etching rate and a fourth height of the STI material in the second portion at a fourth etching rate less than the third etching rate; and performing a radical treatment process on the STI material after the first and second etching processes.
 2. The method of claim 1, wherein the first etching process comprises dispensing ammonia and hydrogen fluoride precursors into an etching chamber.
 3. The method of claim 2, wherein the first etching process further comprises maintaining a temperature of the etching chamber between about 25° C. and about 50° C.
 4. The method of claim 1, wherein the second etching process comprises dispensing ammonia and nitrogen trifluoride precursors into an etching chamber.
 5. The method of claim 4, wherein the second etching process further comprises generating plasma on the ammonia and nitrogen trifluoride precursors.
 6. The method of claim 1, further comprising forming an other fin protruding from the substrate and adjacent to the fin, wherein the other fin comprises: a third sidewall opposing the second sidewall, wherein the first portion of the STI material is formed between the second and third sidewalls; and a fourth sidewall formed opposite to the third sidewall.
 7. The method of claim 1, wherein a ratio of the first etching rate over the second etching rate is greater than or equal to about 1 and less than about
 2. 8. The method of claim 1, wherein a ratio of the third etching rate over the fourth etching rate is less than or equal to 1 and greater than about 0.5.
 9. The method of claim 1, wherein the radical treatment process comprises dispensing hydrogen and an inert gas into an etching chamber.
 10. A method, comprising: forming a plurality of fins protruding from a substrate, the plurality of fins comprising first and second outermost fins, wherein: the first outermost fin comprises a first inner sidewall and a first outer sidewall formed opposite to the first inner sidewall; and the second outermost fin comprises: a second inner sidewall opposing the first inner sidewall; and a second outer sidewall formed opposite to the second inner sidewall; depositing a shallow-trench isolation (STI) material on the substrate, comprising: depositing a first portion of the STI material between the first and second inner sidewalls; and depositing a second portion of the STI material in contact with the first and second outer sidewalls; performing a first etching process on the STI material to etch the first portion of the STI material at a first etching rate and the second portion of the STI material at a second etching rate greater than the first etching rate; performing a second etching process on the STI material to etch the first portion of the STI material at a third etching rate and the second portion of the STI material at a fourth etching rate less than the third etching rate; and performing a radical treatment process on the STI material after the first and second etching processes.
 11. The method of claim 10, wherein the first etching process comprises dispensing ammonia and hydrogen fluoride precursors into an etching chamber.
 12. The method of claim 11, wherein the first etching process further comprises maintaining a temperature of the etching chamber between about 25° C. and about 50° C.
 13. The method of claim 10, wherein the second etching process comprises dispensing ammonia and nitrogen trifluoride precursors into an etching chamber.
 14. The method of claim 13, wherein the second etching process further comprises generating plasma on the ammonia and nitrogen trifluoride precursors.
 15. A method, comprising: forming first and second fins protruding from a substrate: depositing a shallow-trench isolation (STI) material on the substrate, wherein the STI material comprises a first portion in contact with outer sidewalls of the first and second fins and a second portion between inner sidewalls of the first and second fins; performing a first etching process on the STI material to etch the first portion of the STI material at a first etching rate and the second portion of the STI material at a second etching rate different from the first etching rate; performing a radical treatment process with hydrogen and an inert gas on the STI material after the first etching process; and performing a second etching process on the STI material to etch the first portion of the STI material at a third etching rate and the second portion of the STI material at a fourth etching rate different from the third etching rate.
 16. The method of claim 15, further comprising performing an additional radical treatment process on the STI material after the second etching process.
 17. The method of claim 15, wherein performing the radical treatment process comprises dispensing the hydrogen and the inert gas into an etching chamber.
 18. The method of claim 15, wherein a ratio of the first etching rate over the second etching rate is greater than or equal to about 1 and less than about
 2. 19. The method of claim 15, wherein a ratio of the third etching rate over the fourth etching rate is less than or equal to 1 and greater than about 0.5. 